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As artificial intelligence accelerates demand for high-performance computing (HPC), the race is on to keep the world’s data centers cool—without driving up energy costs. Vertiv, a global provider of critical digital infrastructure, has launched the Vertiv CoolLoop Trim Cooler, an advanced thermal management system designed for AI and HPC environments.

The system, announced today, is built to support both air and liquid cooling applications, promising greater efficiency and sustainability for modern AI factories.

With power-hungry AI models pushing data centers beyond their thermal limits, traditional cooling methods are proving inadequate. The Vertiv CoolLoop Trim Cooler offers a 70% reduction in annual cooling energy consumption by leveraging free cooling and mechanical operation, all while taking up 40% less space than conventional systems.

The system is optimized for environments where supply water temperatures fluctuate up to 40°C and cold plate functionality reaches 45°C, making it particularly suited for high-density AI workloads.

Sam Bainborough, vice president of Vertiv’s thermal business for EMEA, underscored the urgency of innovation in data center cooling: “AI is dramatically changing the cooling profiles of today’s data centers, requiring innovative approaches to managing the thermal challenges inherent in 100kW+ racks. Today’s announcement, and the ongoing expansion of Vertiv’s industry-leading high-density thermal management portfolio, allow us to deliver pioneering, future-ready liquid cooling and chilled water solutions to meet our customers’ AI-driven demands.”

Integration that saves time and space

The Vertiv CoolLoop Trim Cooler is designed for seamless integration with existing liquid-cooled environments, working in tandem with Vertiv’s CoolChip CDU (coolant distribution units) for direct-to-chip cooling. It also supports direct integration with immersion cooling systems, reducing installation complexity and ensuring compatibility across various high-density setups.

By minimizing operational and infrastructure costs, Vertiv aims to make high-density AI cooling more accessible. The system utilizes a low-GWP refrigerant and provides scalable cooling capacity up to nearly 3 MW in its air-cooled configuration. With free cooling coils optimized for high ambient temperatures, the system can operate in free cooling mode for longer periods, cutting down electricity consumption and CO₂ emissions.Future-Proofing Against Climate and Regulatory Pressures

With the 2027 EU F-GAS regulations ban on high-GWP refrigerants looming, Vertiv’s new solution is already compliant, ensuring that data centers won’t need expensive redesigns to meet future environmental mandates. By integrating free cooling with high ambient temperature capabilities, the Vertiv CoolLoop Trim Cooler helps operators manage thermal loads more sustainably while future-proofing their infrastructure against tightening regulations.